PACK EXPO International 2008
McCormick Place, Chicago, Illinois

November 9-13, 2008
Booth # S-1147

 

Filamatic is pleased to announce we will be exhibiting in Pack Expo International 2008! Please stop by our booth, S-1147, to see the latest in liquid filling technology. We provide liquid filling solutions for a variety of industries including pharmaceutical, medical, biotech, diagnostic, food, beverage, personal care, household products, and chemical specialties. Representatives from all areas of our business will be available to discuss solutions for your liquid filling needs.

Pack Expo will be located at McCormick Place in Chicago, Illinois November 9-13, 2008. Please email us at info@filamatic.com if you have any questions or if you would like to schedule a meeting at our show booth.

We look forward to seeing you!

 

Interphex 2009
Jacob K. Javits Convention Center, New York, NY

March 17th-19th
Booth # 2159

 

Mark you calendar! Filamatic will be exhibiting the latest liquid filling technology in booth #2159 at Interphex 2009.